- BGA placement from 0.4 mm pitch to large packages; 0.25 mm CSP.
- Nitrogen reflow with thermal profiling for each board.
- X-ray inspection of BGA, QFN and other hidden joints.
- Rework: decap, repopulation and chip-level repair.
- We follow manufacturers' published heat-cycle limits; internal rework is under 1%.
Getting BGAs right the first time
Most BGA defects (voids, head-in-pillow, bridging, opens) start with the reflow profile, the stencil or how the parts were handled. Our process controls each one:
- Thermal profiling. A reflow profile developed for each board and verified, in nitrogen reflow.
- Moisture control. Datasheet review of every part, including moisture sensitivity and reflow limits.
- X-ray verification. Hidden joints are inspected by X-ray, not assumed good.
Compare inspection methods in our guide to PCB inspection and test.
BGA rework and repair
When a BGA has to come off (a design change, a failed part, a field return), the rework has to stay within the component's thermal budget. Every extra reflow uses up reliability you don't get back. We follow the heat-cycle limits manufacturers publish, and our rework capability covers decap, repopulation and chip-level repair, verified with X-ray afterwards.
Process capability
| Capability | Surface Art, San Jose |
|---|---|
| Assembly | SMT, through-hole and mixed technology; hand, wave and selective solder; press-fit |
| Smallest parts | 01005 passives · 0.4 mm-pitch BGA · 0.25 mm CSP · fine-pitch QFN |
| Board size | Up to 18" × 24"; single, double and high-layer-count boards |
| Line | 4 Juki SMT work cells, nitrogen reflow, up to ~171,000 placements per hour |
| Solder | Sn63/Pb37 (leaded) and SAC 305 (lead-free) |
| Inspection & test | AOI on every build · X-ray · flying probe · thermal · functional and in-circuit test fixtures |
| Quality system | ISO 9001:2015 · ISO 13485 · IPC-A-610 · UL Registered Firm |
| Registration | ITAR-registered · woman- and minority-owned small business |
| Facility | 40,000 sq ft in San Jose, CA, in operation since 1995 |
Getting a quote
For BGA assembly, send the standard data package: BOM in Excel with MPNs, Gerber/ODB++/IPC-2581, and a PDF assembly drawing. For rework, tell us the board, the package, how many units are affected and what failed. Email quotes@surfaceart.com.
Frequently asked questions
What is the smallest BGA pitch Surface Art can assemble?
0.4 mm-pitch BGA, plus 0.25 mm CSP and 01005 passives, on boards up to 18 by 24 inches.
How do you inspect BGA solder joints?
With X-ray inspection, since BGA joints are hidden under the package and can't be seen by optical inspection.
Do you rework boards built by another manufacturer?
Contact us with the board, the package and what failed, and we'll tell you whether we can take it on.
Where is BGA assembly done?
In Surface Art's facility in San Jose, California.